Researchers from Washington University in St. Louis, the Massachusetts Institute of Technology, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame have demonstrated monolithic 3D integration of layered 2D materials into novel processing hardware for artificial intelligence computing. The device contains six atomically thin 2D layers, each with its own function, and achieves significantly reduced processing time, power consumption, latency, and footprint. This is accomplished through tightly packing the processing layers to ensure dense interlayer connectivity. This discovery offers a novel solution to integrate electronics and opens the door to a new era of multifunctional computing hardware.
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