Researchers from Lehigh University, the U.S. Army Research Laboratory, Arizona State University, and Louisiana State University have developed a nanostructured copper alloy with exceptional thermal stability and mechanical strength, making it one of the most resilient copper-based materials ever created. The breakthrough comes from the formation of copper-lithium precipitates, stabilized by a tantalum-rich atomic bilayer complexion. Unlike typical grain boundaries that migrate over time at high temperatures, this complexion acts as a structural stabilizer, maintaining the nanocrystalline structure, preventing grain growth and dramatically improving high-temperature performance. The U.S. Army Research Laboratory was awarded a U.S. patent for the alloy.
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