Researchers Create Materials With Unique Combo of Stiffness, Thermal Insulation

Researchers from North Carolina State University and Texas A&M University have created materials that are stiff and can insulate against heat. This combination of properties is unusual and holds promise for the development of thermal insulation coatings for electronic devices. The researchers were working with a subset of a class of materials called two-dimensional hybrid organic-inorganic perovskites (2D HOIP). The researchers found at least three distinct 2D HOIP materials that became less thermally conductive as their stiffness increased.