Researchers expand microchip capability with new 3D inductor technology

Date posted
Funding Agency
(Funded by the National Science Foundation and the U.S. Department of Energy)

A team of engineers at the University of Illinois at Urbana-Champaign has boosted the performance of its previously developed 3D inductor technology by adding as much as three orders of magnitudes more induction to meet the performance demands of modern electronic devices. The researchers filled the already-rolled membranes with an iron oxide nanoparticle solution using a tiny dropper, which allowed the microchip inductors to operate at higher frequency with less performance loss.