Sensors NSI: Sensor Development




National Network for Manufacturing Innovation (NNMI): The NNMI is intended to create a competitive, effective, and sustainable manufacturing research-to-manufacturing infrastructure for U.S. industry and academia to solve industry-relevant problems. NNMI consists of linked Institutes for Manufacturing Innovation (IMIs) with common goals, but unique concentrations: 

Illustrated here are (left to right) an optical tranducer, which measures light; an electro/chemical tranducer, which measures electrical properties; a magnetic tranducer, which measures changes to the local magnetic field; and a mechanical transducer, which detects changes in motion. (Image by N.R. Fuller, Sayo-Art.)
  • America Makes: Formerly the National Additive Manufacturing Innovation Institute. America Makes aims to accelerate the adoption of additive manufacturing technologies in the U.S. manufacturing sector and to increase domestic manufacturing competitiveness.
  • Digital Manufacturing and Design Innovation Institute (DMDII): The DMDII is applying cutting-edge digital technologies to reduce the time and cost of manufacturing, strengthen the capabilities of the U.S. supply chain, and reduce acquisition costs. The DMDII will both develop and demonstrate digital manufacturing technologies and deploy and commercialize these technologies across key manufacturing industries.
  • Lightweight Innovations for Tomorrow (LIFT): LIFT provides the commercial and military sectors with innovative solutions for lightweight subsystem design, component-level manufacturing, joining, and assembly processes and quality control methods (e.g., distortion-control during joining and heat treatment).
  • Power America: The mission of PowerAmerica is to develop advanced manufacturing processes that will enable large-scale production of wide bandgap (WBG) semiconductors, which allow electronic components to be smaller, faster and more efficient than semiconductors made from silicon.
  • Institute for Advanced Composites Manufacturing Innovation (IACMI): IACMI aims to increase U.S. manufacturing competitiveness of advanced composites materials and structures through engagement with industry and organizations across the nation. 
  • American Institute for Manufacturing Integrated Photonics (AIM Photonics): AIM Photonics is an industry driven public-private partnership that focuses the nation’s premiere capabilities and expertise to capture critical global manufacturing leadership in a technology that is both essential to National security and positioned to provide a compelling return-on-investment to the U.S. economy. The Institute’s goal is to emulate the dramatic successes experienced by the electronics industry over the past 40 years and transition key lessons, processes, and approaches to the photonic integrated circuit (PIC) industry. AIM Photonics supports Small and Medium Enterprises, providing practical access and technology on-ramps for U.S. industry, government, and academic communities. 
  • Flexible Hybrid Electronics (NEXTFLEX): NEXTFLEX will pioneer a new era of advanced Flexible Hybrid Electronics manufacturing in the U.S. by catalyzing a U.S. FHE ecosystem, providing new manufacturing capability to the Department of Defense and industry partners, developing multiple product demonstrators, educating and training professionals and technicians, and exploiting the Silicon Valley’s innovation culture.
  • Pending Institutes: Smart Manufacturing and Revolutionary Fibers and Textiles.

International Microelectronics Assembly and Packaging Society (IMAPS): IMAPS is dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses, and other efforts.

MEMS Industry Group: The MEMS industry group (MIG) links the MEMS and sensors supply chain to strategic markets and helps companies in and around the MEMS and sensors industries to make meaningful business connections. Device manufacturers, software designers, materials and equipment suppliers, foundry partners, market analysts, and OEM integrators all plug into the MIG network to form alliances that will move their businesses forward.

Sematech: Sematech operates as a not-for-profit consortium that performs research and development to advance chip manufacturing. Members include companies from all industry sectors, including integrated device manufacturers, foundries, and fabless companies, as well as equipment, materials, and component-level suppliers from North America, Asia, and Europe.

TechLink: TechLink is a U.S. Department of Defense (DoD) Partnership Intermediary per Authority 15 USC 3715, based at Montana State University, Bozeman. Its primary activity is brokering license agreements between DoD labs and U.S. industry for manufacture and use of DoD inventions. These inventions involve virtually all technology fields, including medicine, software, electronics, communications, advanced materials, and energy-related technologies.

The Nano-Bio Manufacturing Consortium (NBMC) was formed by FlexTech Alliance, for the U.S. Air Force Research Laboratory (AFRL), in collaboration with a nationwide group of industry partners.  The mission of NBMC is to bring together leading scientists, engineers, and business development professionals from industry and universities in order to work collaboratively in a consortium, and to mature an integrated suite of nano-bio manufacturing technologies to transition to industrial manufacturing.

[1] A number of organizations have produced resources that may be relevant to the sensors development community. Links to these external resources are provided for informational purposes only, and the NNCO does not make any representation as to the accuracy of information, endorse any views expressed, or endorse or approve any commercial products or private interests that may be advertised or available on these sites.